Lower cost of test, higher throughput

Traditional test systems used for WLR, PCM, and Die-Sort do not have the measurement dynamic range or resolution to meet the new efficiency requirements (higher voltage, lower leakage current, lower on-resistance), or they require time-consuming manual reconfiguration to switch between low- and high-voltage tests. To meet your fab’s productivity goals, you can no longer afford to manually switch between two separate test systems for low voltage and high voltage semiconductor testing. Only Keithley can perform fully automatic wafer-level tests up to 3kV in a single probe touchdown.

Move from high voltage to low voltage without changing test set up.

Perform all high- and low-voltage tests in a single pass without changing equipment or test setup. Get full 3kV sourcing capability combined with sub-pA measurement resolution, which eliminates the need to re-configure the test setup or use two separate test systems when moving from high voltage to low voltage breakdown tests. Minimize connectivity issues due to manual cabling and probing. Reduce false failures by ensuring high quality measurements. Safely rely on test results to adjust manufacturing process parameters to maximize yields.

High Voltage Wafer Testing in a Production Environment

Measure capacitance without manual reconfiguration

Automate all Capacitance tests, including complex 3-terminal measurements. Fully automate 2- or 3-terminal transistor capacitance measurements to quickly evaluate switching characteristics such as speed, energy, and charge with Keithley’s high voltage switching matrix.

High Voltage Wafer Testing in a Production Environment

Fast automation

Minimize test times, maximize test throughput and reduce cost of test with Keithley’s Test Script Processing (TSP) technology and virtual backplane (TSP-Link) that enables high-speed triggering, timing, and synchronization between all elements of the system.

High Voltage Wafer Testing in a Production Environment	Achieving Maximum Parametric Test Throughput
Application note	Application note
This application note explores several measurement techniques and approaches that enable automated HV wafer level characterization on multiple pins without sacrificing low voltage performance or throughput, as well as share results and experiences in the emerging field of HV wafer-level testing.	This application note explores several measurement techniques and approaches that enable automated HV wafer level characterization on multiple pins without sacrificing low voltage performance or throughput, as well as share results and experiences in the emerging field of HV wafer-level testing.
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Automated Parametric Test

Lower cost of test, higher throughput

Move from high voltage to low voltage without changing test set up.

Measure capacitance without manual reconfiguration

Fast automation

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